Ultra Low Loss Bonding Ply Circuit Board Material
Laminate Part Number: Meteorwave 4000 P

Nelco M-Ply™ prepreg is designed for RF/digital constructions, including bonding PTFE to PTFE and PTFE to digital printed circuit boards. M-Ply can be used wherever bonding between RF structures or hybrids of RF and digital structures require high bond strength, excellent and consistent signal integrity, good fill and flow prepreg characteristics, and excellent thermal and environmental reliability. Like all of the Meteorwave family of products, M-Ply will facilitate high temperature lead-free assembly, CAF resistance and low Z-axis expansion.

Data Sheet: USA / Metric
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IPC 4101/ 102
PCB Materials Slash Sheet Reference

UL Rating: 94 V-0
Nelco Electronic Materials UL / CTI Table

Tg °C (DMA) 200°C


  • Lead-Free Assembly
  • RoHS Compliant
  • CAF Resistant

Dielectric Constant: 3.3 @ 10 GHz

Dissipation Factor: 0.0021 @ 10 GHz